• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Shown is a printed circuit board with two metallic outer layers (1, 2) and at least one, in particular metallic, intermediate layer (3), - wherein in the case of a metallic intermediate layer between the outer layers (1, 2) and the intermediate layer (3) insulating layers (4) are arranged on at least one of the outer surfaces of the printed circuit board at least one contact surface for a component to be cooled (9), - wherein on the opposite outer surface of the circuit board at least one cooling element (11) is arranged, and - wherein the contact surface for the component (9) to be cooled is electrically insulated from the cooling element (11) by means of a plate (5) made of insulated metal substrate. It is provided that the contact surface for the component to be cooled (9) by one or more metallic vias (13) is connected to the opposite outer surface of the circuit board, where the wafer (5) made of insulated metal substrate attached to the outside of the outer surface of the circuit board and in contact with the cooling element (11).
    公开号:AT517221A4
    申请号:T50347/2015
    申请日:2015-04-29
    公开日:2016-12-15
    发明作者:Leopold Ing Hellinger；Armin Koch；Gerhard Ing Neumann
    申请人:Melecs Ews Gmbh & Co Kg；
    IPC主号:
    专利说明:

    Description PCB Technical area
    The invention relates to a printed circuit board with two metallic outer layers and at least one, in particular metallic, intermediate layer, - wherein in the case of a metallic intermediate layer between the outer layers and the intermediate layer insulating layers are arranged, - wherein on at least one of the outer surfaces of the printed circuit board at least one contact surface for a is arranged cooling element, - wherein on the opposite outer surface of the circuit board at least one cooling element is arranged, and - wherein the contact surface for the component to be cooled by means of a small plate of insulated metal substrate is electrically isolated from the cooling element. The invention also includes a method for manufacturing a corresponding circuit board, wherein a standard circuit board (such as a FR-4 multilayer circuit board) can be used as the starting material.
    A printed circuit board (PCB) is a support for electronic components. It serves for mechanical fastening and electrical connection. Circuit boards are made of electrically insulating material with adhering, conductive connections (conductors). Fiber-reinforced plastic is common as insulating material, but the circuit board could also be made of ceramic or contain one or more ceramic or metal layers.
    The tracks are etched from a thin conductive layer (mostly copper). The layer thickness is typically 35 pm and for applications with higher currents between 70 pm and 140 pm. In order to enable thinner printed conductors, also printed circuit boards are produced with only 18 pm conductive layer. The devices are soldered to pads (solder pads, pads) or pads, which are also etched from the thin conductive layer. By soldering the components are connected to the circuit board, so mechanically attached to the circuit board and electrically contacted simultaneously.
    The dimensions of printed circuit boards are standardized, the usual thicknesses of the printed circuit boards are between 1 and 3 mm.
    Background Art For printed circuit boards with high heat dissipation requirements, base materials with metal cores such as aluminum or copper are used, e.g. in the field of lighting technology with high-performance light-emitting diodes. These support materials are also referred to as direct bonded copper or as insulated metal substrate (IMS).
    In addition, platelets made of insulated metal substrate can be introduced under components with high heat development within the printed circuit board, in which the insulating layers, for example, have particularly good temperature resistance, ie have a higher temperature resistance than the insulating layers of the printed circuit board. The layers of the plate are arranged parallel to the plane of the circuit board or to the layers of the circuit board and are enclosed by the metallic outer layers of the circuit board in the circuit board.
    A disadvantage of this arrangement of the small plate is that for the time being, the circuit board without the metallic outer layers and the adjacent insulating layers must be made, then in the circuit board is a continuous
    Milled recess, inserted the plate and then insulating layers and the two metallic outer layers of the circuit board are applied.
    Presentation of the invention
    It is therefore an object of the present invention to provide a printed circuit board which has insulating layers with particularly good temperature resistance at the locations provided for high-heat components, but is easier to manufacture.
    This object is achieved by a printed circuit board having the features of patent claim 1. Advantageous embodiments of the invention are defined in the respective dependent claims.
    Claim 1 refers to an initially mentioned printed circuit board with two metallic outer layers and at least one, in particular metallic, intermediate layer, - wherein in the case of a metallic intermediate layer between the outer layers and the intermediate layer insulating layers are arranged, - wherein on at least one of the outer surfaces of the printed circuit board at least one Contact surface is arranged for a component to be cooled, - wherein on the opposite outer surface of the circuit board at least one cooling element is arranged, and - wherein the contact surface for the component to be cooled by means of a small plate of insulated metal substrate is electrically isolated from the cooling element. If the printed circuit board has a plurality of metallic intermediate layers, then in each case an insulating layer is present between these intermediate layers. If no metallic intermediate layers are present, there must in any case be at least one insulating layer as an intermediate layer, which separates the two metallic outer layers from one another.
    According to the invention, the contact surface for the component to be cooled is connected by one or more metallic plated-through holes to the opposite outer surface of the printed circuit board, where the plate of insulated metal substrate is externally attached to the outer surface of the printed circuit board and in contact with the cooling element.
    The fact that the plate of insulated metal substrate is now no longer located inside the circuit board, a standard printed circuit board with metallic outer layers can be used. It therefore eliminates the milling of the inner layers of the circuit board and the subsequent application of the metallic outer layers of the circuit board in comparison to previous printed circuit boards.
    The application of vias, the so-called thermal vias, in printed circuit boards, however, is simply possible and is a standard process in printed circuit board production. The primary task of the vias, which are usually normal, especially straight, to the circuit board level, is to improve the thermal conductivity ; They use the high thermal conductivity of copper, the most common material of the through-hole. By a dense arrangement of such vias, for example in a grid of 0.5 mm and a diameter of 0.25 mm, effectively up to 10% copper can be introduced into the circuit board.
    The platelets of insulated metal substrate can be obtained inexpensively with optimum panel utilization directly from the raw material manufacturer as stamped products, which are manufactured from plates of insulated metal substrate. The effort for the production of the circuit board (boardhouse effort) can be reduced.
    The wafer according to the invention may comprise an insulating layer which is embedded between two metal layers, wherein a first metal layer contacts the printed circuit board and the second metal layer contacts the cooling element. Through the insulation layer, the circuit board is galvanically separated from the cooling element through the metal layers is given a good heat conduction. The layers of the plate usually run parallel to the layers of the circuit board.
    In this case, the first metal layer of the plate may be thinner than the second metal layer. This is due to the manufacturing method of the isolated metal substrate. In this case, a thin dielectric layer (about 30-100 microns thick) is applied to a metallic base plate, such as copper or aluminum, and then again a metal layer (about 35-200 microns thick). The dielectric is made as thin as possible in comparison with metal-poor heat conduction. The abutment of the first (thinner) metal layer on the circuit board and the second (thicker) metal layer on the cooling element has the advantage that the metallic material of the second metal layer and that of the cooling element can be the same, e.g. Aluminum, and therefore no corrosion problems are to be expected.
    The cooling element may have an exemption for the platelets and abut laterally adjacent to the platelet on the outer surface of the outer layer of the circuit board. In this way, the heat absorbed by the plate can be well delivered to the cooling element, such as a heat sink, because the platelet - except for its contact surface with the circuit board - is completely surrounded by the heat sink.
    It is particularly favorable if the cooling element has an exemption for the plate, which is dimensioned such that the plate is held by the cooling element both in contact with the metallic plated-through holes and with the cooling element. Because then the plate does not have to be attached to the circuit board, but is simply held by the heat sink in place.
    The plate and cooling element can be connected to one another by means of notch or press connection in order to prevent a lateral movement (= parallel to the plane of the printed circuit board in the assembled state of the cooling element or plate) of the chip in the release of the cooling element.
    Once the circuit board is populated, a device to be cooled is disposed on the contact surface for a device to be cooled, such as a power transistor (e.g., a MOSFET) or a light emitting diode (e.g., a power LED).
    A method for producing a - in particular according to the invention - printed circuit board provides - that in a printed circuit board with two metallic outer layers and at least one, in particular metallic, intermediate layer, wherein in the case of the metallic intermediate layer between the outer layers and the intermediate layer insulating layers are arranged one or more Metallic vias are produced, which connect a contact surface for a component to be cooled on an outer surface of the printed circuit board with the opposite outer surface of the printed circuit board, and - that on the opposite outer surface of the printed circuit board, a plate of insulated metal substrate outside of the outer surface of the printed circuit board to the Vias is attached and the plate is brought into contact with a cooling element, which is also attached to this outer surface.
    Preferably, the cooling element on an exemption for the platelet, in which the plate is inserted and brought by mounting the cooling element on the circuit board, the inserted plate permanently on the one hand with the metallic vias and on the other hand with the cooling element in contact. The insertion of the plate can be done by the manufacturer of the cooling element, which is usually simply a heat sink. The circuit board can then be mounted as usual in the electronics factory, with the cooling element is mounted with the plate after the assembly of the other components and after checking the circuits.
    With a printed circuit board according to the invention logical areas and power ranges of an electronic circuit can be accommodated on a circuit board, it eliminates the arrangement on two separate printed circuit boards with plug connection.
    Brief description of the figures
    To further explain the invention, reference is made in the following part of the description to the figures, from which further advantageous embodiments, details and further developments of the invention can be found. Show it
    1 is a schematic representation of a circuit board according to the prior art in cross section,
    Fig. 2 is a schematic representation of a circuit board according to the invention in cross section
    Embodiment of the invention
    In Fig. 1, a circuit board is shown, the two metallic outer layers 1, 2, two metallic intermediate layers 3 and between the metallic layers 1-3 each having an insulating layer 4. The metallic layers 1-3 are made of copper here and are shown here the same thickness. The thickness of the metallic outer layers 1, 2 is typically between 18 and 105 micrometers, the thickness of the metallic intermediate layers 3 is typically between 18 and 50 micrometers. The insulating layers 4 here have a thickness of about 50 micrometers and contain so-called preimpregnated fibers, which are also referred to as prepreg, prepreg is the English short form for preimpregnated fibers. Preimpregnated fibers are semi-finished textile products preimpregnated with reactive resins, which are cured under pressure and temperature for the production of printed circuit boards. In particular, the insulating layers 4 can belong to class FR-4, a class of flame retardant and flame retardant composites consisting of epoxy resin and glass fiber fabric.
    Inside the printed circuit board, more precisely in the layers 3, 4, a small plate 5 made of insulated metal substrate is now provided, which here has a square base surface in the plane of the printed circuit board. The plate 5 is constructed in three layers, with a first metal layer 6, which contacts the first metallic outer layer 1 of the printed circuit board from the inside, with a second metal layer 7, which contacts the second metallic outer layer 2 of the printed circuit board from the inside and with an insulating layer 8, which both metal layers 6,7 galvanically separated from each other.
    In the manufacture of the printed circuit boards, the metallic intermediate layers 3 and the insulating layer 4 located therebetween are first connected to one another, then a recess is milled into each of the layers 3, 4, which recess has to correspond to the outer dimensions of the chip 5. Subsequently, the plate 5 is inserted into the recess and it is the outer insulating layers 4 and then the metallic outer layers 1, 2 applied to the intermediate layers 3, so that the inner surfaces of the metallic outer layers 1, 2 come into contact with the plate 5, more precisely with the Outside surfaces of the metal layers 6, 7.
    Platelet 5 is - seen in the plane of the circuit board - wider than the component to be cooled 9, which is attached to the outer surface of the circuit board, more precisely, the first metallic outer layer 1, via a contact surface.
    The heat generated by the component 9 is passed through the outer layer 1, the plate 5 and the outer layer 2 on the side opposite the component 9 side of the circuit board, where a cooling element 11, here a metallic heat sink, such as aluminum, in two-dimensional Contact with the outer surface of the outer layer 2 is. On the circuit board 1.2 more standard components 10 are arranged on one or both outer layers. Some standard components 10 are arranged in an exemption 12 of the heat sink 11.
    2, a circuit board according to the invention is shown. The structure of the individual layers 1-4 of the circuit board is the same as in Fig. 1, as is the structure of the plate with its layers 6-8. Again, the base of the plate 5 is square, it could of course be rectangular or have a different shape, which corresponds to the contours of the component to be cooled 9. However, the plate 5 is not arranged here in the circuit board, but outside the circuit board, namely the component to be cooled 9 opposite on the other side of the circuit board, on the outer surface of the second outer layer 2. So still the heat from the component 9 to the wafer. 5 can be conducted, in a region of the circuit board, which is slightly wider than the component 9 (or the corresponding contact surface for the component 9), at regular intervals vias 13 are provided, which run straight and normal to the plane of the circuit board and the connect both outer surfaces of the circuit board thermally and galvanically conductive. The plated-through holes 13 must cover at least the area below the component 9. While the component 9 to be cooled is connected to the plated-through holes 13 on one side of the printed circuit board, on the other side of the printed circuit board the small plate 5 is connected to the plated-through holes 13 with its first (thin) metal layer 6. The second (thick) metal layer 7 of the plate 5 is in thermal and galvanic contact with the inside of an exemption 14 for the plate 5 in the heat sink 11. Normal to the circuit board corresponds to the dimension of the exemption 14 of the thickness of the plate 5, so that the plate 5 is not has to be attached to the circuit board, but only by the heat sink 11 is pressed against the circuit board, which must be attached to the circuit board anyway. Laterally, so left and right in Fig. 2, the plate 5 from the heat sink 11, so the walls of the exemption 14, spaced, so there is no short circuit between the first metal layer 6 and heat sink 11.
    The same heat sink 11 can also, as in FIG. 1, have an exemption for further components, such as standard components 10. Apart from the exemptions 12, 14, the heat sink 11 lies flat against the second metallic outer layer 2. The heat sink 11 will usually be made of aluminum.
    In Fig. 1, both metal layers 6, 7 of the plate 5 should be made of the same material as the metallic outer layers 1, 2 of the circuit board, so that no unfavorable voltage series arise because the plate 5 yes on the outer layers 1, 2 is applied. In Fig. 1, the metal layers 6, 7 should therefore be made of copper. In Fig. 2, at least the second, thicker metal layer 7, which bears against the heat sink 11, may be made of a different material than the outer layer 2 of the printed circuit board, e.g. made of aluminium. This has the advantage that the plate 5 becomes lighter compared to the embodiment in FIG. 1.
    In the choice of the materials of the metal layers 6, 7 of the plate 5 is also on any metallic coatings of the circuit board or the metallic outer layers 1, 2 take care so that it does not come to unwanted potential differences.
    Platelet 5 and heat sink 11 may be connected to each other by means of notch or press connection, so that the position of the plate 5 is set within the release position 14 parallel to the circuit board level. This ensures that when mounting the heat sink 11 to the circuit board, the wafer 5 is properly positioned relative to the vias 13. Once the heat sink 11 is mounted, the plate can no longer slip due to the force exerted by the heat sink 11 force anyway.
    The first 6 and second metal layer 7 of the plate 5 may be made of copper or aluminum. The first metal layer 6 typically has a thickness of 50 microns, the second metal layer 7 1000-1500 microns. The insulating layer 8, which galvanically separates the two metal layers 6, 7, typically only has a thickness of 30-50 micrometers, if corresponding available dielectrics with high heat resistance are used. Thus, for example, dielectrics are available which, at a thickness of 38 micrometers, have a glass transition temperature of 185 ° C. with a specific thermal conductivity of 7-10 W / m * K.
    The total thickness of the wafer 5 is thus typically 1000-1500 micrometers.
    LIST OF REFERENCES: 1 first (upper) metallic outer layer 2 second (lower) metallic outer layer 3 metallic intermediate layer 4 insulating layer 5 platelets of insulated metal substrate 6 first metal layer of the platelet 5 7 second metal layer of the platelet 5 8 insulating layer of the platelet 5 9 component to be cooled 10 standard components 11 Cooling element (heat sink) 12 Exemption for standard components 10 13 Through holes 14 Exemption for plates 5
    权利要求:
    Claims (8)
    [1]
    claims
    1. printed circuit board with two metallic outer layers (1, 2) and at least one, in particular metallic, intermediate layer (3), - arranged in the case of a metallic intermediate layer between the outer layers (1, 2) and the intermediate layer (3) insulating layers (4) are arranged on at least one of the outer surfaces of the circuit board at least one contact surface for a component to be cooled (9), - wherein on the opposite outer surface of the circuit board at least one cooling element (11) is arranged, and - to be cooled component (9) by means of a small plate (5) of insulated metal substrate is electrically isolated from the cooling element (11), characterized in that the contact surface for the component to be cooled (9) by one or more metallic vias (13) with the opposite lying outer surface of the circuit board is connected, where the plate (5) of insulated metal substrate mounted externally on the outer surface of the circuit board and in contact with the cooling element (11).
    [2]
    2. Printed circuit board according to claim 1, characterized in that the plate (5) has an insulating layer (8) which is embedded between two metal layers (6, 7), wherein a first metal layer (6) contacts the circuit board and the second metal layer ( 7) the cooling element.
    [3]
    3. Printed circuit board according to claim 2, characterized in that the first metal layer (6) is thinner than the second metal layer (7).
    [4]
    4. Printed circuit board according to one of claims 1 to 3, characterized in that the cooling element (11) has an exemption (14) for the plate (5) and laterally adjacent to the plate (5) abuts the outer surface of the outer layer of the circuit board.
    [5]
    5. Printed circuit board according to one of claims 1 to 4, characterized in that the cooling element (11) has an exemption (14) for the plate (5), which is dimensioned such that the plate (5) through the cooling element (11). both in contact with the metallic vias (13) and with the cooling element (11) is held.
    [6]
    6. Printed circuit board according to one of claims 4 or 5, characterized in that plate (5) and cooling element (11) are connected to each other by means of notch or press connection.
    [7]
    7. A method for producing a printed circuit board, characterized in that - in a printed circuit board with two metallic outer layers (1, 2) and at least one, in particular metallic, intermediate layer (3), wherein in the case of the metallic intermediate layer between the outer layers (1, 2 ) and the intermediate layer (3) insulating layers (4) are arranged, one or more metallic vias (13) are produced, which connect a contact surface for a component to be cooled (9) on an outer surface of the printed circuit board with the opposite outer surface of the printed circuit board, and - that on the opposite outer surface of the printed circuit board, a plate (5) made of insulated metal substrate on the outer surface of the circuit board at the vias (13) is mounted and the plate (5) with a cooling element (11), which also on this outer surface is placed in contact.
    [8]
    8. The method according to claim 7, characterized in that the cooling element (11) has an exemption (14) for the plate (5), in which the plate is inserted and by mounting the cooling element (11) on the circuit board, the inserted plate ( 5) is permanently brought on the one hand with the metallic plated-through holes (13) and on the other hand with the cooling element (11) in contact.
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    同族专利:
    公开号 | 公开日
    AT517221B1|2016-12-15|
    EP3089565A1|2016-11-02|
    引用文献:
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    JPH1140901A|1997-07-23|1999-02-12|Sharp Corp|Circuit board|
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    CN104284533B|2008-09-28|2019-03-19|华为技术有限公司|Multilayer circuit board and preparation method thereof and communication equipment|
    DE202010016256U1|2010-12-07|2012-03-19|Schoeller-Electronics Gmbh|circuit board|
    DE102012020838A1|2012-10-24|2014-04-24|Schoeller-Electronics Gmbh|circuit board|CN108235559A|2016-12-21|2018-06-29|钰桥半导体股份有限公司|Wiring board and its preparation method with separator and bridgeware|
    DE102017221861A1|2017-12-05|2019-06-06|Zf Friedrichshafen Ag|Printed circuit board and method for manufacturing a printed circuit board|
    法律状态:
    2020-08-15| PC| Change of the owner|Owner name: MELECS EWS GMBH, AT Effective date: 20200714 |
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50347/2015A|AT517221B1|2015-04-29|2015-04-29|circuit board|ATA50347/2015A| AT517221B1|2015-04-29|2015-04-29|circuit board|
    EP16162575.1A| EP3089565A1|2015-04-29|2016-03-29|Conductor board|
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